This item doesn’t have any media yet
1995 | Technical
The dynamic nature of the microelectronics industry, in particular within the area of packaging, requires a continuous updating and revision of priorities. In an effort to communicate these priorities to researchers and engineers in the field, the National Technology Road Map was developed. This proceedings volume, the eighth in a series on electronic packaging, focuses on the materials research, development and processing issues identified in the road map. Topics include: an overview of the National Technology Road Map for Semiconductors; institutional and industrial perspectives; impact on materials needs and materials science issues; and research responses. Technical subtopics include polymers, ceramics, solder and composites.
Peter Borgesen
(Author)
| Published by | Materials Research Society |
| Edition | Unknown |
| ISBN | 9781558992931 |
| Language | N/A |
Images And Data Courtesy Of: Materials Research Society.
This content (including text, images, videos and other media) is published and used in accordance
with Fair Use.